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Clad Material - List of Manufacturers, Suppliers, Companies and Products

Clad Material Product List

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SIGMA clad material

SIGMA clad material

Cladding material for battery pack joining! Reduced thickness due to improved conductivity. Enhanced welding strength.

"SIGMA clad material" is a cladding material for joining in Li-Ion battery packs. It has compatibility with resistance welding and laser welding, and the surface is suitable for soldering. It exhibits excellent conductivity due to pure nickel. The stainless steel layer improves welding strength while remaining lightweight. 【Features】 ■ Compatibility with resistance welding and laser welding ■ Solderable surface ■ Superior conductivity compared to pure nickel ■ High electrical capacity *For more details, please download the PDF or feel free to contact us.

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Ni/Cu clad

Ni/Cu clad

Clad material for battery pack bonding! Exhibits excellent electrical conductivity and thermal diffusivity.

"Ni/Cu clad" is a clad material for joining lithium-ion battery packs that possesses excellent electrical conductivity and thermal diffusivity. It reduces costs compared to pure nickel. It exhibits excellent contact corrosion resistance. [Features] - Superior solderability and weldability compared to Cu - Excellent electrical conductivity and thermal diffusivity - Excellent contact corrosion resistance - Cost advantages compared to pure nickel *For more details, please download the PDF or feel free to contact us.

  • Other metal materials

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Clad material "AL/Cu (C1020, C19400, C5191)"

Clad material "AL/Cu (C1020, C19400, C5191)"

Introducing clad materials for lead frames that meet the demands for the miniaturization and development of integrated circuits!

The materials AL/Cu (C1020, C19400, C5191) are used in bellows for high-output IGBTs and in lead frames for integrated circuits sealed with low-melting-point glass using AL/42Ni clad material. AL is welded with SiAl wire, and 4J42 or 4J29 is compatible with low-melting-point glass for sealing. In addition, our company offers clad materials such as "AL/42Ni," "Cu/42Ni," and "AgCu/42Ni." 【Features】 ■ Used in bellows for high-output IGBTs ■ Used in lead frames for integrated circuits sealed with low-melting-point glass using AL/42Ni clad material ■ AL is welded with SiAl wire, and 4J42 or 4J29 is compatible with low-melting-point glass for sealing ■ C1020 and C19400 serve a conductive role and meet the demands for miniaturization of integrated circuits *For more details, please refer to the PDF document or feel free to contact us.

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